Huawei has developed a new chip scaling law and architecture aiming for advanced manufacturing by 2031, potentially bypassing ASML's limitations. However, analysts caution that China's pursuit of semiconductor independence remains challenging due to ongoing manufacturing obstacles.

Huawei Technologies has engineered a workaround to one of China’s most crippling chipmaking bottlenecks, but analysts warn that the nation’s path to semiconductor independence is still constrained by manufacturing challenges. The US-sanctioned tech giant on Monday introduced a new scaling law and a chip architecture designed to deliver products equivalent to an advanced 1.4-nanometre processing node by 2031. If true, the innovation marks a significant milestone for Huawei, which has been cut off...