Scientists in China developed a novel wafer-scale method for 2D semiconductor growth, achieving a 1,000-fold increase in speed. This advancement addresses physical limitations in scaling chip technology demanded by AI and large language models.

Chinese scientists say they have developed a wafer-scale 2D semiconductor growth method with 1,000 times faster growth, paving the way for industry advances. The surging demand for high‑performance, low‑power chips driven by AI and large-language models has intensified the search for next‑generation semiconductor technologies. Moore’s Law predicted a doubling of semiconductor capacity every two years but as chip dimensions continue to shrink, physical limitations make further performance scaling...